Turnkey CEM3 PTFE Prototype Smt Pcb Assembly Services OEM
Material | FR4 | Colour | Black |
---|---|---|---|
Size | 170mm*230mm | Surface | HASL |
Layer | 8 | Name | PCBA |
High Light | CEM3 PTFE Prototype Smt Pcb Assembly,CEM3 turnkey pcb assembly services,Smt Pcb Assembly Services OEM |
PCBA Capability
We have 14 SMT lines,20 DIP lines,9 Assembly lines,12 testing lines.
We also provide technical support for our customer on analysis of design for manufacturability,product fault judgment,PCB layout components selection and component replacement evaluation,etc.
Everything is assembled here under the supervision of expert engineers. If you want to launch your product and uncertain about circuit boards, our team is 24/7 ready to help you.
Our Advantages:
1. Flexible operation-provide prototype and quick delivery.
2. Competitive price-strong material sourcing team,always get the best price to help you save cost.
3. Big global processing and manufacturing bases-located in Shenzhen,Dongguan,Wuping of China,Portland of America and Vietnam.
4. High quality products-well equipped and strictly managed,stick to rigorous quality management,procedure control and sets up 100% automatic AOI inspection.
Certified by ISO 9001,ISO14001,TS16949,ISO13485,UL and Disney FAMA etc.
5. One stop solution- integrating material puchasing,production processing and finished product reliability test.
1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
7 | PCBA QC | X-ray,AOI Test,Functional Test |
8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |
